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AP2552/ap2553/AP2552a/ap2553a document number: ds35404 rev. 5 - 2 1 of 16 www.diodes.com december 2012 ? diodes incorporated new product a p2552/ ap2553/ AP2552a/ ap2553a precision adjustable curre nt-limited power switches description the AP2552/53and AP2552a/53a are single channel precision adjustable current-limited switches optimized for the applications require precision current limiting or to provide up to 2.1a of continuous load current during heav y loads/short ci rcuits. these devices offer a programmable curr ent-limit threshold between 75ma and 2.35a (typ) via an external resistor. current limit accuracy 6% can be achieved at high current-limit settings. the rise and fall times are controlled to minimize current surges during turn on/off. the devices have fast short-circuit response timefor im proved overall system robustness. they provide a complete protection solution for applications subject to heavy capac itive loads and the prospect of short circuit, offering reverse cu rrent blocking and limiting, over- current, over-temperature and short- circuit protection, as well as controlled rise time and under-vol tage lockout functionality. a 7ms deglitch capability on the open-drain flag output prevents false over-current reporting and does not require any external components. AP2552/53 limits the output current to a safe level when the output current exceeds current-limit threshold. AP2552a/53a provides latch-off f unction during over-current or reverse-voltage conditions. all devices are available in sot26 and u-dfn2020c-6 packages. applications ? set-top-boxes ? lcd tvs & monitors ? residential gateways ? laptops, desktops, servers, e-readers, printers, docking stations, hubs pin assignments pad 1 2 3 6 5 4 in gnd en out fault ilim u-dfn2020c-6 (top view) in gnd en out fault ilim 6 5 4 1 2 3 (top view) sot26 features ? up to 2.1a maximum load current ? accurate adjustable current limit, 75ma - 2350ma ? 6% accurate adjustable current limit, 1.61a with r lim = 15k ? ? constant-current (AP2552/ 53) during over-current ? output latch-off (AP2552a/53a) at over-current ? fast short-circuit re sponse time: 2s (typ) ? reverse current blocking during shutdown and reverse current limiting during enable ? operating range: 2.7v ? 5.5v ? built-in soft-start with 3ms typical rise time ? over-current , output ove r-voltage and thermal protection ? fault report (fault) with blanking time ? esd protection: 2kv hbm, 500v cdm ? active low (AP2552/52a) or active high (ap2553/53a) enable ? ambient temperature range: -40oc to +85c ? sot26 and dfn2020-6 package: available in ?green?molding compound (no br, sb) ? totally lead-free & fully rohs compliant (notes 1 & 2) ? halogen and antimony free. ?green? device (note 3) ? 15kv esd protection per iec 61000-4-2 (with external capacitance) ? ul recognized, file number (to be completed) ? iec60950-1 cb scheme certified (to be completed) notes: 1. no purposely added lead. fully eu dire ctive 2002/95/ec (rohs) & 2011 /65/eu (rohs 2) compliant. 2. see http://www.diodes.com for more in formation about diodes incorpor ated?s definitions of halogen- and antimony-free, "gree n" and lead-free. 3. halogen- and antimony-free "green? products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total br + cl) and <1000ppm antimony compounds. http://www..net/ datasheet pdf - http://www..net/
AP2552/ap2553/AP2552a/ap2553a document number: ds35404 rev. 5 - 2 2 of 16 www.diodes.com december 2012 ? diodes incorporated new product a p2552/ ap2553/ AP2552a/ ap2553a typical applications circuit 120f output capacitance is a requirement of usb available options part number channel enable pin (en) recommended maximum continuous load current (a) current-limit protection package AP2552 1 active low 2.1 constant-current u-dfn2020c-6 sot26 ap2553 1 active high AP2552a 1 active low 2.1 latch-off u-dfn2020c-6 sot26 ap2553a 1 active high pin descriptions pin name pin number i/o function AP2552w6-7 ap2553w6-7 AP2552fdcg-7 ap2553fdcg-7 in 1 1 6 6 i input, connect a 0.1f or greater ceramic capacitor from in to gnd as close to ic as possible. gnd 2 2 5 5 ? ground, connect to external exposed pad. en 3 ? 4 ? i enable input, logic low turns on power switch. en ? 3 ? 4 i enable input, logic high turns on power switch. fault 4 4 3 3 o active-low open-drain output, asserted during over- current, over-temperature, or reverse-voltage conditions. ilim 5 5 2 2 o use external resistor to set current-limit threshold; recommended 10k ? Qrlim Q 232k ? . out 6 6 1 1 o output exposed pad ? ? pad pad ? no internal connection; recommend to connect to gnd externally for improved power dissipation. http://www..net/ datasheet pdf - http://www..net/
AP2552/ap2553/AP2552a/ap2553a document number: ds35404 rev. 5 - 2 3 of 16 www.diodes.com december 2012 ? diodes incorporated new product a p2552/ ap2553/ AP2552a/ ap2553a functional block diagram http://www..net/ datasheet pdf - http://www..net/
AP2552/ap2553/AP2552a/ap2553a document number: ds35404 rev. 5 - 2 4 of 16 www.diodes.com december 2012 ? diodes incorporated new product a p2552/ ap2553/ AP2552a/ ap2553a absolute maximum ratings (@t a = +25c, unless otherwise specified.) symbol parameter ratings unit esd hbm human body model esd protection 2 kv esd cdm charged device model esd protection 500 v vin, vout, v fault , vilim, ,en v en v voltage on in, out, fault , ilim, en, en -0.3 to +6.5 v continuous fault sink current 25 ma ilim source current 1 ma i load maximum continuous load current internal limited a t jmax maximum junction temperature -40 to +150 c t st storage temperature range (note 4) -65 to +150 c note: 4. ul recognized rating from -30c to +70c (diodes qualified t st from -65c to +150c) caution: stresses greater than the 'absolute maximum ratings' sp ecified above, may cause permanent damage to the device. these are stress ratings only; functional operation of the device at th ese or any other conditions exceeding those indicated in this specification is not imp lied. device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time. semiconductor devices are esd sensitive and may be damaged by ex posure to esd events. suitable esd precautions should be taken when handling and transporting these devices. dissipation rating table board package thermal resistance ja thermal resistance jc t a +25c power rating derating factor above t a = +25c t a = +70c power rating t a = +85c power rating high-k (note 5) w6 160 c/w 55 c/w 625mw 6.25mw/ c 340mw 250mw high-k (note 5) fdc 120 c/w 34 c/w 833mw 8.33mw/ c 450mw 330mw note: 5. the jedec high-k (2s2p) board used to derive this data was a 3in x 3in, multilayer board with 1-ounce internal power a nd ground planes with 2-ounce copper traces on top and bottom of the board. recommended operating conditions (@t a = +25c, unless otherwise specified.) symbol parameter min max unit v in input voltage 2.7 5.5 v i out continuous output current (-40 c ? t a ? +85 c) 0 2.1 a ,en v en v enable voltage 0 5.5 v v ih high-level input voltage on en or en 2.0 v in v v il low-level input voltage on en or en 0 0.8 v r lim current-limit threshold resistor range (1% initial tolerance) 10 210 k i o continuous fault sink current 0 10 ma input de-coupling capacitance, in to gnd 0.1 f t a operating ambient temperature -40 +85 c t j operating junction temperature -40 +125 c http://www..net/ datasheet pdf - http://www..net/
AP2552/ap2553/AP2552a/ap2553a document number: ds35404 rev. 5 - 2 5 of 16 www.diodes.com december 2012 ? diodes incorporated new product a p2552/ ap2553/ AP2552a/ ap2553a electrical characteristics (@t a = +25c, v in = 2.7v to 5.5v, v en = 0v or v en = v in , r fault = 10k ? , unless otherwise specified.) symbol parameter test conditions (note 6) min typ max unit supply v uvlo input uvlo v in rising 2.4 2.65 v v uvlo input uvlo hysteresis v in decreasing 25 mv i shdn input shutdown current v in = 5.5v, disabled, out = open 0.1 1 a i q input quiescent current v in = 5.5v, enabled, out = open, r lim = 20k ? 100 140 a v in = 5.5v, enabled, out = open, r lim = 210k ? 80 120 a i rev reverse leakage current disabled, v in = 0v, v out = 6v, i rev at v in 0.01 1 a power switch r ds(on) switch on-resistance sot26 package, t j = +25c, v in = 5.0v 70 95 m ? -40 o c t a +85c 135 u-dfn2020-6 package t j = +25c, v in = 5.0v 80 105 -40 o c t a +85c 150 t r output turn-on rise time v in = 5.5v, c l = 1f, r load = 100 ? . see figure 1 1.1 1.5 ms v in = 2.7v, c l = 1f, r load = 100 ? . 0.7 1 ms t f output turn-off fall time v in = 5.5v, c l = 1f, r load = 100 ? . see figure 1 0.1 0.5 ms v in = 2.7v, c l = 1f, r load = 100 ? . 0.1 0.5 ms current limit i limit current-limit threshold (maximum dc output current), v out = v in -0.5v r lim = 10k ? -40c t a +85c 2200 2365 2542 ma r lim = 15k ? -40c t a +85c 1540 1632 1730 r lim = 20k ? t j = +25c 1180 1251 1326 -40c t a +85c 1160 1251 1340 r lim = 49.9k ? t j = +25c 500 530 562 -40c t a +85c 485 529 573 r lim = 210k ? 121 142 162 i lim shorted to in or gnd 50 75 100 i short short-circuit current limit, out connected to gnd r lim = 10k ? 2620 ma r lim = 15k ? 1820 r lim = 20k ? 1380 r lim = 49.9k ? 570 r lim = 210k ? 150 i lim shorted to in or gnd 75 t short short-circuit response time v out = 0v to i out = i limit (out shorted to ground) see figure 2 2 s enable pin i leak-en en input leakage current v in = 5v, v en = 0v and 6v -0.5 0.5 a t on turnon time c l = 1f, r l = 100 ? . see figure 1 3 ms t off turnoff time c l = 1f, r l = 100 ? . see figure 1 1 ms output discharge r dis discharge resistance (note 7) v in = 5v, disabled, i out =1ma 600 ? r dis_latch discharge resistance during latch-off v in = 5v, latch-off, AP2552a/53a only 1000 ? notes: 6. pulse-testing techniques maintain junction temperature close to ambient temper ature; thermal effects must be taken in to account separately. 7. the discharge function is active when the device is disabled (when enable is de-asserted or during power-up power-down when v in < v uvlo ). the discharge function offers a resistive discharge path for the external storage capacitor for limited time. http://www..net/ datasheet pdf - http://www..net/
AP2552/ap2553/AP2552a/ap2553a document number: ds35404 rev. 5 - 2 6 of 16 www.diodes.com december 2012 ? diodes incorporated new product a p2552/ ap2553/ AP2552a/ ap2553a electrical characteristics (cont.) (@t a = +25c, v in = 2.7v to 5.5v, v en = 0v or v en = v in , r fault = 10k ? , unless otherwise specified.) symbol parameter test conditions (note 6) min typ max unit reverse voltage protection v rvp reverse-voltage comparator trip point v out ? v in 95 135 190 mv irocp reverse current limit v out ? v in = 200mv 0.72 a t trig time from reverse-voltage condition to mosfet turn off (AP2552a/ap2553a) v in = 5v 3 4.75 7 ms fault flag v ol fault output low voltage i fault = 1ma 180 mv i foh fault off current v fault = 6v 1 a t blank_oc fault blanking and latch off time (over-current) assertion or deassertion due to overcurrent 5 7.5 10 ms t blank_rv fault blanking time (reverse-voltage) assertion or deassertion due to reverse-voltage 2 3.75 6 ms thermal shutdown t shdn thermal shutdown threshold enabled, r load = 1k ? 160 c t shdn_ocp thermal shutdown threshold under current limit enabled, r load = 1k ? 140 c t hys thermal shutdown hysteresis 20 c note: 6. pulse-testing techniques maintain junction temperature cl ose to ambient temperature; thermal effects must be taken int o account separately. typical performance characteristics v en 90% v out t d(on) 10% t d(off) 50% 50% t r 10% 90% t f v en 90% v out t d(on) 10% t d(off) 50% 50% t r 10% 90% t f figure 1. voltage waveforms: AP2552/52a (left), ap2553/53a (right) figure 2. response time to short circuit waveform http://www..net/ datasheet pdf - http://www..net/
AP2552/ap2553/AP2552a/ap2553a document number: ds35404 rev. 5 - 2 7 of 16 www.diodes.com december 2012 ? diodes incorporated new product a p2552/ ap2553/ AP2552a/ ap2553a typical performance characteristics 2ms/div figure 3. turn-on delay and rise time 2ms/div figure 4. turn-off delay and fall time 500s/div figure 5. device enabled into short-circuit 2ms/div figure 6. no load to 1 ? transient response 2ms/div figure 7. short-circui t current limit response 2ms/div figure 8. extended short-circuit into thermal cycles v in = 5v r lim = 20k ? r out = 5 ? v in = 5v r lim = 20k ? r out = 5 ? v in = 5v r lim = 20k ? r out = 0 ? http://www..net/ datasheet pdf - http://www..net/
AP2552/ap2553/AP2552a/ap2553a document number: ds35404 rev. 5 - 2 8 of 16 www.diodes.com december 2012 ? diodes incorporated new product a p2552/ ap2553/ AP2552a/ ap2553a typical performance characteristics (cont.) 1ms/div figure 9. reverse current limit response(AP2552a/ap2553a) figure 10. reverse current limit vs. ambient temperature figure 11. quiescent current vs. ambient temperature figure 12. quiescent current vs. ambient temperature figure 13. switch on-resistance vs. ambient temperature figure 14. under-voltage lock out vs. ambient temperature http://www..net/ datasheet pdf - http://www..net/
AP2552/ap2553/AP2552a/ap2553a document number: ds35404 rev. 5 - 2 9 of 16 www.diodes.com december 2012 ? diodes incorporated new product a p2552/ ap2553/ AP2552a/ ap2553a application note the AP2552/53 and AP2552a/53a are integrated high-side power switc hes optimized for universal serial bus (usb) that requires pr otection functions. the power switches are equipped with a driver that controls the gate voltage and incorporates slew-rate limitation. this, along with the various protection features and special f unctions, makes these power switches ideal for hot-swap or hot-plug applications. protection features: under-voltage lockout (uvlo) whenever the input voltage falls below uvlo threshold (~2.5v), the power switch is turned off. this facilitates the design of h ot-insertion systems where it is not possible to turn off the power switch before input power is removed. over-current and short-circuit protection an internal sensing fet is employed to c heck for over-current conditions. unlike curr ent-sense resistors, sense fets do not inc rease the series resistance of the current path. when an overcurrent condition is detected, the device maintains a constant output current and r educes the output voltage accordingly. complete shutdown occurs only if the fault stays long enough to activate thermal limiting. the different overload conditions and t he corresponding response of the AP2552/53 and AP2552a/53a are outlined below: s.no conditions explanation behavior of the AP2552/53 and AP2552a/53a 1 short-circuit condition at start-up output is shorted before input voltage is applied or before the part is enabled the ic senses the short circui t and immediately clamps output current to a certain safe level namely i short. 2 short-circuit or overcurrent condition short-circuit or overload condition that occurs when the part is enabled. ? at the instance the overload occurs, higher current may flow for a very short period of time before the current limit function can react. ? after the current limit functi on has tripped (reached the over- current trip threshold), the device switches into current limiting mode and the current is clamped at i short /i limit . 3 gradual increase from nominal operating current to i limit load increases gradually until the current-limit threshold.(i trig ) the current rises until i limit or thermal limit. once the threshold has been reached, the device switches into its current limiting mode and is set at i limit . note that when the output has been shorted to gnd at extremely low temperature (< -30c), a minimum 120- f electrolytic capacitor on the output pin is recommended. a correct capacitor type with capacitor voltage rating and temperature characteristics must be prop erly chosen so that capacitance value does not drop too low at the extremely lo w temperature operation. a recommended capacitor should have t emperature characteristics of less than 10% variati on of capacitance change when operated at extr emely low temp. our recommended aluminum electrolytic capacitor type is panasonic fc series. current-limit threshold programming the current-limit threshold can be programm ed using an external resistor. the current- limit threshold is proportional to the cu rrent sourced out of i lim . the recommended 1% resistor range for r lim is 10k ? r lim 210k ? . figure 15 includes current-limit tolerance due to variations caused by temperature and process. this graph does not include the external re sistor tolerance. the traces routing the rlim resistor to t he AP2552/53 and AP2552a/53a should be as short as possible to reduce parasitic effects on the current-limit accuracy. to design below a maximum current-limit threshold, find the intersection of r lim and the maximum desired load current on the i os(max) (i lim ) curve and choose a value of r lim above this value. programming the current limit below a maximum threshold is important to avoid current limiting upstream power supplies causing the input voltage bus to droop. the resulting minimum current-limit threshold is the i ntersection of the selected value of r lim and the i os(min) (i lim ) curve. http://www..net/ datasheet pdf - http://www..net/
AP2552/ap2553/AP2552a/ap2553a document number: ds35404 rev. 5 - 2 10 of 16 www.diodes.com december 2012 ? diodes incorporated new product a p2552/ ap2553/ AP2552a/ ap2553a application note (cont.) current-limit threshold programming (cont.) current-limit threshold equations (i limit ): = k 20200 )ma(i 91.0 lim )max(lim r = k 20620 )ma(i 94.0 lim )typ(lim r = k 20211 )ma(i 96.0 lim )min(lim r figure 15. current-limit threshold vs r lim thermal protection thermal protection prevents the ic from damage when the die temperat ure exceeds safe margins. this mainly occurs when heavy-ove rload or short-circuit faults are pres ent for extended periods of time. the AP2552/53 and AP2552a/53a implements a thermal sensing to mo nitor the operating junction temperature of the power distribution switch. once the die temperature rises to approximately +160c (140c in case the part is under current limit), the thermal protection feature gets activa ted as follows: the internal thermal sense circuitry turns t he power switch off and the fault output is asserted thus preventing the power switch from damage. hysteresis in the thermal sense circuit allows the d evice to cool down by approximately +20c before the output is turned back on. this built-in thermal hysteresis feature is an excellent feature, as it avoids undesirable oscillations of the thermal prot ection circuit. the switch continues to cycle in this manner until the load fault is removed, resulting in a pulsed output. reverse-current and reverse-voltage protection the usb specification does not allow an output device to source current back into the usb port. in a normal mosfet switch, curr ent will flow in reverse direction (from the output side to the input side) when the output side voltage is higher than the input side. a revers e-current limit (rocp) feature is implemented in the AP2552/53 and AP2552a/53a to limit su ch back currents. the rocp circuit is activated when the out put voltage is higher than the input voltage. after the reverse current circuit has tripped (reached the reverse current trip thres hold), the current is clamped at this irocp level. in addition to rocp, reverse over-voltage protection ( rovp ) is also implemented. the ro vp circuit is activated by the reverse voltage comparator trip point ie; the difference between the output voltage and the input voltage. for AP2552/53, once rovp is activated, fault assertion occurs at a de-glitch time of 4ms. recovery from rovp is automatic when the fault is removed. fault de-assertion de-glitch ti me is same as the de-assertion time. http://www..net/ datasheet pdf - http://www..net/
AP2552/ap2553/AP2552a/ap2553a document number: ds35404 rev. 5 - 2 11 of 16 www.diodes.com december 2012 ? diodes incorporated new product a p2552/ ap2553/ AP2552a/ ap2553a application note (cont.) reverse-current and reverse-voltage protection (cont.) for AP2552a/53a, once rovp is activated and when the condition exis ts for more than 5ms (typ), output device is disabled and sh utdown. this is called the "time from reverse-voltage condition to mosfet turn off?. fault assertion occurs at a de-glitch time of 4ms after rovp is reached. recovery from this fault is achiev ed by recycling power or toggling en. fault de-assertion de-glitch time is same as t he de-assertion time. special functions: discharge function when enable is de-asserted, or when the input voltage is under uvlo level, the discharge function is active. the output capacitor is discharged through an internal nmos that has a discharge resistance of 100 ? . hence, the output voltage drops down to zero. the time taken for discharge is dependent on the rc time constant of the resistance and the output capacitor. fault response the fault open-drain output goes active low for any of following faults: current limit threshold, short- circuit current limit, reverse-voltage condition or thermal shutdown. the time fr om when a fault condition is encountered to wh en the fault output goes low is 7ms (ty p). the fault output remains low until over-current, short-circuit current limit and over-tempera ture conditions are removed. connectin g a heavy capacitive load to the output of the device can cause a momentary over-current condi tion, which does not trigger the fault due to the 7ms deglitch timeout. this 7-ms timeout is also applicable for over-current recovery and over-temperature recovery. the AP2552/53 a nd AP2552-2/53a are designed to eliminate errone ous over-current reporting without the need for external components, such as an rc delay network. for the AP2552/53 and AP2552a/53a when the reverse voltage condition is triggered, fault output goes low after 4ms (typ). this 4ms (typ) timeout is also applicable for the recovery from reverse voltage fault. when the ilim pin is shorted to in or gnd, current-limit th reshold and short-circuit current limit will be clamped at typically 75ma.when the ilim pin is shorted to in or gnd the AP2552/53 and AP2552a/53a fault pi n will not assert during current limiting conditions; the fau lt pin will assert during short circuit conditions. power supply considerations a 0.01- f to 0.1- f x7r or x5r ceramic bypass capacitor between in and gnd, cl ose to the device, is recommended. this limits the input voltage drop during line transients. placing a high-value electrolytic capacitor on the input (10 f minimum) and output pin(120f) is recommended when the output load is heavy. this precaution also reduces power-supply transients t hat may cause ringing on the i nput. additionally, bypassing thedeviceoutput with a 0.1 f to 4.7 f ceramic capacitor improves the immunity of the device to short-circuit transients. this capacitor also prevents output from going ne gative during turn-off due to parasiticinductance. power dissipation and junction temperature the low on-resistance of the internal mosfet allows the small surface-mount packages to pass large current. using the maximum o perating ambient temperature (t a ) and r ds(on) , the power dissipation can be calculated by: p d = r ds(on) i 2 finally, calculate the junction temperature: t j = p d x ja + t a where: t a = ambient temperature c ja = thermal resistance p d = total power dissipation generic hot-plug applications in many applications it may be necessary to remove modules or pc boards while the main unit is still operating. these are consi dered hot-plug applications. such implementations require t he control of current surges seen by the main power supply and the card being inser ted. the most effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a power supply normally turns on. due to the controlled rise times and fall times of the AP2552/53 and AP2552a/53a, these devices can be used to provide a softer start-up to devices being hot-plugged into a powered system. the uvlo feature of the AP2552/53 and AP2552a/ 53a also ensures that the switch is off after the card has been remov ed, and that the switch is off during the next insertion. http://www..net/ datasheet pdf - http://www..net/
AP2552/ap2553/AP2552a/ap2553a document number: ds35404 rev. 5 - 2 12 of 16 www.diodes.com december 2012 ? diodes incorporated new product a p2552/ ap2553/ AP2552a/ ap2553a application note (cont.) generic hot-plug applications by placing the AP2552/53 and AP2552a/53a between the v cc input and the rest of the circuitry, t he input power reaches these devices first after insertion. the typical rise time of the switch is approxim ately 1ms, providing a slow voltage ramp at the output of the d evice. this implementation controls system surge current and provides a hot-plugging mechanism for any device. ordering information ? packa g e ap 255x x x xx -7 packin g 7 : tape & reel latch-off blank : non latch-off fdc : u-dfn2020c-6 w6 : sot26 a : latch-off enable 2 : active low 3 : active high part number enable active output fault condition package code packaging 7? tape and reel quantity part number suffix AP2552w6-7 low output current limits w6 sot26 3000/tape & reel -7 AP2552fdc-7 fdc u-dfn2020c-6 3000/tape & reel -7 ap2553w6-7 high w6 sot26 3000/tape & reel -7 ap2553fdc-7 fdc u-dfn2020c-6 3000/tape & reel -7 AP2552aw6-7 low output latches off w6 sot26 3000/tape & reel -7 AP2552afdc-7 fdc u-dfn2020c-6 3000/tape & reel -7 ap2553aw6-7 high w6 sot26 3000/tape & reel -7 ap2553afdc-7 fdc u-dfn2020c-6 3000/tape & reel -7 marking information (1) sot26 1 2 3 6 7 4 xx y w x xx : identification code y : year 0~9 x : internal code ( top view ) 5 w : week : a~z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week device package identification code AP2552w6 sot26 bj ap2553w6 sot26 bk AP2552aw6 sot26 bm ap2553aw6 sot26 bn http://www..net/ datasheet pdf - http://www..net/
AP2552/ap2553/AP2552a/ap2553a document number: ds35404 rev. 5 - 2 13 of 16 www.diodes.com december 2012 ? diodes incorporated new product a p2552/ ap2553/ AP2552a/ ap2553a marking information (cont.) (2) u-dfn2020c-6 ( top view ) xx y : year : 0~9 x : internal code xx : identification code w : week : a~z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week y w x device package identification code AP2552fdc u-dfn2020c-6 bj ap2553fdc u-dfn2020c-6 bk AP2552afdc u-dfn2020c-6 bm ap2553afdc u-dfn2020c-6 bn package outline dimensions (all dimensions in mm.) please see ap02002 at http://www.diodes.com /datasheets/ap02002.pdf for latest version. (1) package type: sot26 (2) package type: u-dfn2020-6 sot26 dim min max typ a 0.35 0.50 0.38 b 1.50 1.70 1.60 c 2.70 3.00 2.80 d ? ? 0.95 h 2.90 3.10 3.00 j 0.013 0.10 0.05 k 1.00 1.30 1.10 l 0.35 0.55 0.40 m 0.10 0.20 0.15 0 8 ? all dimensions in mm u-dfn2020-6 dim min max typ a 0.57 0.63 0.60 a1 0 0.05 0.03 a3 ? ? 0.15 b 0.20 0.30 0.25 d 1.95 2.075 2.00 d2 1.45 1.65 1.55 e ? ? 0.65 e 1.95 2.075 2.00 e2 0.76 0.96 0.86 l 0.30 0.40 0.35 all dimensions in mm a m j l d b c h k seating plane d2 d e pin#1 id l b d2/2 e2 e a1 a a3 http://www..net/ datasheet pdf - http://www..net/
AP2552/ap2553/AP2552a/ap2553a document number: ds35404 rev. 5 - 2 14 of 16 www.diodes.com december 2012 ? diodes incorporated new product a p2552/ ap2553/ AP2552a/ ap2553a suggested pad layout please see ap02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. (1) package type: sot26 (2) package type: u-dfn2020-6 dimensions value (in mm) z 3.20 g 1.60 x 0.55 y 0.80 c1 2.40 c2 0.95 dimensions value (in mm) z 1.67 g 0.15 x1 0.90 x2 0.45 y 0.37 c 0.65 g g yc z y x2 x1 x z y c1 c2 c2 g http://www..net/ datasheet pdf - http://www..net/
AP2552/ap2553/AP2552a/ap2553a document number: ds35404 rev. 5 - 2 15 of 16 www.diodes.com december 2012 ? diodes incorporated new product a p2552/ ap2553/ AP2552a/ ap2553a taping orientation (note 11) (1) package type: sot26 (2) package type: u-dfn2020-6 notes: 11. the taping orientation of the other package type can be found on our website at http://www.diodes .com/datasheets/ ap02007.pdf http://www..net/ datasheet pdf - http://www..net/
AP2552/ap2553/AP2552a/ap2553a document number: ds35404 rev. 5 - 2 16 of 16 www.diodes.com december 2012 ? diodes incorporated new product a p2552/ ap2553/ AP2552a/ ap2553a important notice diodes incorporated makes no warranty of any kind, express or implied, with regards to this document, including, but not limited to, the implied warranties of merchantability and fitness for a particular purpose (and their equivalents under the laws of any jurisdiction). diodes incorporated and its subsidiaries rese rve the right to make modifications, enhanc ements, improvements, corrections or ot her changes without further notice to this document and any product described herein. diodes incorporated does not assume any liability ari sing out of the application or use of this document or an y product described herein; neither does diodes incorporated convey any license under its patent or trademark rights, nor the rights of others. any customer or user of this document or products described herein in such applica tions shall assume all risks of such use and will agree to hold diodes incorporated a nd all the companies whose products are represented on diodes incorporated website, harmless against all damages. diodes incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthoriz ed sales channel. should customers purchase or use diodes inco rporated products for any unintended or una uthorized application, customers shall i ndemnify and hold diodes incorporated and its representativ es harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. products described herein may be covered by one or more united states, international or foreign patents pending. product names and markings noted herein may also be covered by one or more un ited states, international or foreign trademarks. this document is written in english but may be translated into multiple languages for reference. only the english version of t his document is the final and determinative format released by diodes incorporated. life support diodes incorporated products are specifically not authorized for use as critical component s in life support devices or systems without the express written approval of the chief executive offi cer of diodes incorporated. as used herein: a. life support devices or syst ems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when proper ly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. b. a critical component is any component in a life support devic e or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. customers represent that they have all necessary expertise in the safety and regulatory ramifi cations of their life support dev ices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning the ir products and any use of diodes incorporated products in su ch safety-critical, life support devices or systems, notwithstanding any devices- or s ystems-related information or support that may be provided by diodes incorporated. further, customers must fully indemnify diodes incorporate d and its representatives against any damages arisi ng out of the use of diodes incorporated pr oducts in such safety-critical, life suppor t devices or systems. copyright ? 2012, diodes incorporated www.diodes.com http://www..net/ datasheet pdf - http://www..net/

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